JPH0434311B2 - - Google Patents

Info

Publication number
JPH0434311B2
JPH0434311B2 JP56184332A JP18433281A JPH0434311B2 JP H0434311 B2 JPH0434311 B2 JP H0434311B2 JP 56184332 A JP56184332 A JP 56184332A JP 18433281 A JP18433281 A JP 18433281A JP H0434311 B2 JPH0434311 B2 JP H0434311B2
Authority
JP
Japan
Prior art keywords
layer
polycrystalline silicon
insulating layer
region
active
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP56184332A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57112034A (en
Inventor
Haaman Toomasu
Rido Arekusandaa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
INTAANASHONARU REKUCHIFUAIYAA CORP
Original Assignee
INTAANASHONARU REKUCHIFUAIYAA CORP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by INTAANASHONARU REKUCHIFUAIYAA CORP filed Critical INTAANASHONARU REKUCHIFUAIYAA CORP
Publication of JPS57112034A publication Critical patent/JPS57112034A/ja
Publication of JPH0434311B2 publication Critical patent/JPH0434311B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/64Double-diffused metal-oxide semiconductor [DMOS] FETs
    • H10D30/66Vertical DMOS [VDMOS] FETs
    • H10D30/665Vertical DMOS [VDMOS] FETs having edge termination structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157Partial encapsulation or coating
    • H01L23/3171Partial encapsulation or coating the coating being directly applied to the semiconductor body, e.g. passivation layer
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/58Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/411Insulated-gate bipolar transistors [IGBT]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D18/00Thyristors
    • H10D18/80Bidirectional devices, e.g. triacs 
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/64Double-diffused metal-oxide semiconductor [DMOS] FETs
    • H10D30/645Bidirectional devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/64Double-diffused metal-oxide semiconductor [DMOS] FETs
    • H10D30/65Lateral DMOS [LDMOS] FETs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/64Double-diffused metal-oxide semiconductor [DMOS] FETs
    • H10D30/66Vertical DMOS [VDMOS] FETs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/102Constructional design considerations for preventing surface leakage or controlling electric field concentration
    • H10D62/103Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/111Field plates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/118Electrodes comprising insulating layers having particular dielectric or electrostatic properties, e.g. having static charges
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/13Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304Transistor
    • H01L2924/1306Field-effect transistor [FET]
    • H01L2924/13091Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/124Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
    • H10D62/126Top-view geometrical layouts of the regions or the junctions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/124Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
    • H10D62/126Top-view geometrical layouts of the regions or the junctions
    • H10D62/127Top-view geometrical layouts of the regions or the junctions of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/13Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
    • H10D62/149Source or drain regions of field-effect devices
    • H10D62/151Source or drain regions of field-effect devices of IGFETs 
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/13Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
    • H10D62/149Source or drain regions of field-effect devices
    • H10D62/151Source or drain regions of field-effect devices of IGFETs 
    • H10D62/156Drain regions of DMOS transistors
    • H10D62/157Impurity concentrations or distributions

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Formation Of Insulating Films (AREA)
  • Bipolar Transistors (AREA)
JP56184332A 1980-11-17 1981-11-17 Planar structure improved for high withstand voltage semiconductor device Granted JPS57112034A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/207,123 US4412242A (en) 1980-11-17 1980-11-17 Planar structure for high voltage semiconductor devices with gaps in glassy layer over high field regions

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP8019251A Division JP2766239B2 (ja) 1980-11-17 1996-01-11 高耐圧半導体装置
JP8019252A Division JP2766240B2 (ja) 1980-11-17 1996-01-11 高耐圧半導体装置

Publications (2)

Publication Number Publication Date
JPS57112034A JPS57112034A (en) 1982-07-12
JPH0434311B2 true JPH0434311B2 (en]) 1992-06-05

Family

ID=22769286

Family Applications (3)

Application Number Title Priority Date Filing Date
JP56184332A Granted JPS57112034A (en) 1980-11-17 1981-11-17 Planar structure improved for high withstand voltage semiconductor device
JP8019251A Expired - Lifetime JP2766239B2 (ja) 1980-11-17 1996-01-11 高耐圧半導体装置
JP8019252A Expired - Lifetime JP2766240B2 (ja) 1980-11-17 1996-01-11 高耐圧半導体装置

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP8019251A Expired - Lifetime JP2766239B2 (ja) 1980-11-17 1996-01-11 高耐圧半導体装置
JP8019252A Expired - Lifetime JP2766240B2 (ja) 1980-11-17 1996-01-11 高耐圧半導体装置

Country Status (9)

Country Link
US (1) US4412242A (en])
JP (3) JPS57112034A (en])
CA (1) CA1175953A (en])
CH (1) CH656255A5 (en])
DE (1) DE3145231C3 (en])
FR (1) FR2494499A1 (en])
GB (1) GB2087648B (en])
IT (1) IT1196932B (en])
SE (1) SE462309B (en])

Families Citing this family (74)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4412242A (en) 1980-11-17 1983-10-25 International Rectifier Corporation Planar structure for high voltage semiconductor devices with gaps in glassy layer over high field regions
JPS57160159A (en) * 1981-03-28 1982-10-02 Toshiba Corp High breakdown voltage planar type semiconductor device
US4677452A (en) * 1981-10-26 1987-06-30 Intersil, Inc. Power field-effect transistor structures
US4574209A (en) * 1982-06-21 1986-03-04 Eaton Corporation Split gate EFET and circuitry
JPS5939066A (ja) * 1982-08-27 1984-03-03 Hitachi Ltd 半導体集積回路
US4532534A (en) * 1982-09-07 1985-07-30 Rca Corporation MOSFET with perimeter channel
JPS5976466A (ja) * 1982-10-25 1984-05-01 Mitsubishi Electric Corp プレ−ナ形半導体装置
US4974059A (en) * 1982-12-21 1990-11-27 International Rectifier Corporation Semiconductor high-power mosfet device
DE3346286A1 (de) * 1982-12-21 1984-06-28 International Rectifier Corp., Los Angeles, Calif. Hochleistungs-metalloxid-feldeffekttransistor- halbleiterbauteil
NL8302092A (nl) * 1983-06-13 1985-01-02 Philips Nv Halfgeleiderinrichting bevattende een veldeffekttransistor.
JPS6042855A (ja) * 1983-08-19 1985-03-07 Hitachi Ltd 半導体装置
NL8401117A (nl) * 1984-04-09 1985-11-01 Philips Nv Halfgeleiderinrichting met veldeffekttransistors met geisoleerde poortelektrode.
GB2165090A (en) * 1984-09-26 1986-04-03 Philips Electronic Associated Improving the field distribution in high voltage semiconductor devices
US4631564A (en) * 1984-10-23 1986-12-23 Rca Corporation Gate shield structure for power MOS device
EP0222326A2 (en) * 1985-11-12 1987-05-20 General Electric Company Method of fabricating an improved insulated gate semiconductor device
JP2565317B2 (ja) * 1986-12-03 1996-12-18 富士通株式会社 半導体装置の製造方法
US4789886A (en) * 1987-01-20 1988-12-06 General Instrument Corporation Method and apparatus for insulating high voltage semiconductor structures
US4881106A (en) * 1988-05-23 1989-11-14 Ixys Corporation DV/DT of power MOSFETS
US5003372A (en) * 1988-06-16 1991-03-26 Hyundai Electronics Industries Co., Ltd. High breakdown voltage semiconductor device
US5192993A (en) * 1988-09-27 1993-03-09 Kabushiki Kaisha Toshiba Semiconductor device having improved element isolation area
JPH0783123B2 (ja) * 1988-12-08 1995-09-06 富士電機株式会社 Mos型半導体装置
US5270566A (en) * 1988-12-08 1993-12-14 Fuji Electric Co., Ltd. Insulated gate semiconductor device
JPH02170469A (ja) * 1988-12-22 1990-07-02 Fuji Electric Co Ltd 半導体装置
JP2550702B2 (ja) * 1989-04-26 1996-11-06 日本電装株式会社 電力用半導体素子
US4994891A (en) * 1989-06-20 1991-02-19 Advanced Micro Devices Shielded transistor device
EP0460251B1 (de) * 1990-06-05 1998-11-18 Siemens Aktiengesellschaft Herstellverfahren für einen Leistungs-MISFET
US5404040A (en) * 1990-12-21 1995-04-04 Siliconix Incorporated Structure and fabrication of power MOSFETs, including termination structures
WO1992016998A1 (en) 1991-03-18 1992-10-01 Quality Semiconductor, Inc. Fast transmission gate switch
US6208195B1 (en) 1991-03-18 2001-03-27 Integrated Device Technology, Inc. Fast transmission gate switch
IT1250233B (it) * 1991-11-29 1995-04-03 St Microelectronics Srl Procedimento per la fabbricazione di circuiti integrati in tecnologia mos.
US5323036A (en) * 1992-01-21 1994-06-21 Harris Corporation Power FET with gate segments covering drain regions disposed in a hexagonal pattern
US5366932A (en) * 1993-04-26 1994-11-22 Harris Corporation Semi-conductor chip packaging method and semi-conductor chip having interdigitated gate runners with gate bonding pads
US5396097A (en) * 1993-11-22 1995-03-07 Motorola Inc Transistor with common base region
DE69321966T2 (de) * 1993-12-24 1999-06-02 Consorzio Per La Ricerca Sulla Microelettronica Nel Mezzogiorno, Catania Leistungs-Halbleiterbauelement
DE69321965T2 (de) * 1993-12-24 1999-06-02 Consorzio Per La Ricerca Sulla Microelettronica Nel Mezzogiorno, Catania MOS-Leistungs-Chip-Typ und Packungszusammenbau
US5798287A (en) * 1993-12-24 1998-08-25 Consorzio Per La Ricerca Sulla Microelettronica Nel Mezzogiorno Method for forming a power MOS device chip
JPH07326743A (ja) 1994-05-31 1995-12-12 Fuji Electric Co Ltd プレーナ型半導体素子
EP0689238B1 (en) * 1994-06-23 2002-02-20 STMicroelectronics S.r.l. MOS-technology power device manufacturing process
US5817546A (en) * 1994-06-23 1998-10-06 Stmicroelectronics S.R.L. Process of making a MOS-technology power device
EP1408542A3 (en) * 1994-07-14 2009-01-21 STMicroelectronics S.r.l. High-speed MOS-technology power device integrated structure, and related manufacturing process
DE69418037T2 (de) * 1994-08-02 1999-08-26 Consorzio Per La Ricerca Sulla Microelettronica Ne Leistungshalbleitervorrichtung aus MOS-Technology-Chips und Gehäuseaufbau
US5798554A (en) * 1995-02-24 1998-08-25 Consorzio Per La Ricerca Sulla Microelettronica Nel Mezzogiorno MOS-technology power device integrated structure and manufacturing process thereof
TW344130B (en) 1995-10-11 1998-11-01 Int Rectifier Corp Termination structure for semiconductor device and process for its manufacture
US5940721A (en) * 1995-10-11 1999-08-17 International Rectifier Corporation Termination structure for semiconductor devices and process for manufacture thereof
EP0772241B1 (en) 1995-10-30 2004-06-09 STMicroelectronics S.r.l. High density MOS technology power device
EP0772242B1 (en) * 1995-10-30 2006-04-05 STMicroelectronics S.r.l. Single feature size MOS technology power device
US6228719B1 (en) 1995-11-06 2001-05-08 Stmicroelectronics S.R.L. MOS technology power device with low output resistance and low capacitance, and related manufacturing process
EP0782201B1 (en) * 1995-12-28 2000-08-30 STMicroelectronics S.r.l. MOS-technology power device integrated structure
US5677562A (en) * 1996-05-14 1997-10-14 General Instrument Corporation Of Delaware Planar P-N junction semiconductor structure with multilayer passivation
EP0817274B1 (en) 1996-07-05 2004-02-11 STMicroelectronics S.r.l. Asymmetric MOS technology power device
US5994762A (en) * 1996-07-26 1999-11-30 Hitachi, Ltd. Semiconductor integrated circuit device including boron-doped phospho silicate glass layer and manufacturing method thereof
US5811841A (en) * 1997-04-03 1998-09-22 The United States Of America As Represented By The Secretary Of The Air Force Photoconductive switching with thin layer enhanced breakdown charateristics
DE69839439D1 (de) 1998-05-26 2008-06-19 St Microelectronics Srl MOS-Technologie-Leistungsanordnung mit hoher Integrationsdichte
US6022790A (en) * 1998-08-05 2000-02-08 International Rectifier Corporation Semiconductor process integration of a guard ring structure
JP4644904B2 (ja) * 2000-04-05 2011-03-09 住友電気工業株式会社 パワー半導体素子
GB2373634B (en) 2000-10-31 2004-12-08 Fuji Electric Co Ltd Semiconductor device
JP5011611B2 (ja) 2001-06-12 2012-08-29 富士電機株式会社 半導体装置
US6852634B2 (en) * 2002-06-27 2005-02-08 Semiconductor Components Industries L.L.C. Low cost method of providing a semiconductor device having a high channel density
DE102007020659B4 (de) * 2007-04-30 2012-02-23 Infineon Technologies Austria Ag Halbleiterbauelement und Verfahren zur Herstellung desselben
JP2009076866A (ja) * 2007-08-31 2009-04-09 Sumitomo Electric Ind Ltd ショットキーバリアダイオード
US9484451B2 (en) 2007-10-05 2016-11-01 Vishay-Siliconix MOSFET active area and edge termination area charge balance
JP5272472B2 (ja) * 2008-03-28 2013-08-28 サンケン電気株式会社 半導体装置
WO2013021727A1 (ja) * 2011-08-05 2013-02-14 富士電機株式会社 半導体装置および半導体装置の製造方法
US9431249B2 (en) 2011-12-01 2016-08-30 Vishay-Siliconix Edge termination for super junction MOSFET devices
CN103178109A (zh) * 2011-12-21 2013-06-26 上海华虹Nec电子有限公司 高压隔离型的nldmos结构及其制作方法
US10164043B2 (en) 2012-01-11 2018-12-25 Infineon Technologies Ag Semiconductor diode and method for forming a semiconductor diode
US9614043B2 (en) 2012-02-09 2017-04-04 Vishay-Siliconix MOSFET termination trench
US9842911B2 (en) 2012-05-30 2017-12-12 Vishay-Siliconix Adaptive charge balanced edge termination
US9508596B2 (en) 2014-06-20 2016-11-29 Vishay-Siliconix Processes used in fabricating a metal-insulator-semiconductor field effect transistor
US9887259B2 (en) 2014-06-23 2018-02-06 Vishay-Siliconix Modulated super junction power MOSFET devices
CN105244279B (zh) * 2014-07-10 2018-09-25 北大方正集团有限公司 一种平面型vdmos器件及其制作方法
CN105304701B (zh) * 2014-08-01 2018-06-12 旺宏电子股份有限公司 半导体装置
CN106575666B (zh) 2014-08-19 2021-08-06 维西埃-硅化物公司 超结金属氧化物半导体场效应晶体管
US10998418B2 (en) * 2019-05-16 2021-05-04 Cree, Inc. Power semiconductor devices having reflowed inter-metal dielectric layers

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA667423A (en) * 1963-07-23 Northern Electric Company Limited Semiconductor device and method of manufacture
GB921367A (en) * 1959-04-06 1963-03-20 Standard Telephones Cables Ltd Semiconductor device and method of manufacture
NL297002A (en]) * 1962-08-23 1900-01-01
US3518494A (en) * 1964-06-29 1970-06-30 Signetics Corp Radiation resistant semiconductor device and method
US3489953A (en) * 1964-09-18 1970-01-13 Texas Instruments Inc Stabilized integrated circuit and process for fabricating same
US3492174A (en) * 1966-03-19 1970-01-27 Sony Corp Method of making a semiconductor device
US3821779A (en) * 1966-11-25 1974-06-28 Hitachi Ltd Semiconductor device with high conductivity and high resistivity collector portions to prevent surface inversion
US3497407A (en) * 1966-12-28 1970-02-24 Ibm Etching of semiconductor coatings of sio2
US3632433A (en) * 1967-03-29 1972-01-04 Hitachi Ltd Method for producing a semiconductor device
US3506502A (en) * 1967-06-05 1970-04-14 Sony Corp Method of making a glass passivated mesa semiconductor device
NL162250C (nl) * 1967-11-21 1980-04-15 Philips Nv Halfgeleiderinrichting met een halfgeleiderlichaam, waarvan aan een hoofdoppervlak het halfgeleideroppervlak plaatselijk met een oxydelaag is bedekt, en werkwijze voor het vervaardigen van planaire halfgeleider- inrichtingen.
GB1255995A (en) * 1968-03-04 1971-12-08 Hitachi Ltd Semiconductor device and method of making same
DE1920802A1 (de) * 1968-05-01 1969-11-20 Itt Ind Gmbh Deutsche Planar-Diode mit Durchbruch bei hoher Sperrspannung
US3560810A (en) * 1968-08-15 1971-02-02 Ibm Field effect transistor having passivated gate insulator
JPS4743025Y1 (en]) * 1969-01-25 1972-12-26
JPS501872B1 (en]) * 1970-01-30 1975-01-22
FR2178932A1 (en]) * 1972-04-03 1973-11-16 Motorola Inc
DE2510922A1 (de) * 1975-03-13 1976-09-30 Licentia Gmbh Halbleiteranordnung
GB1499845A (en) * 1975-03-26 1978-02-01 Mullard Ltd Thyristors
JPS5420670A (en) * 1977-07-18 1979-02-16 Toshiba Corp Surface stabilizing method of semiconductor elements
US4219369A (en) * 1977-09-30 1980-08-26 Hitachi, Ltd. Method of making semiconductor integrated circuit device
DE2936724A1 (de) * 1978-09-11 1980-03-20 Tokyo Shibaura Electric Co Halbleitervorrichtung und verfahren zu ihrer herstellung
DK157272C (da) 1978-10-13 1990-04-30 Int Rectifier Corp Mosfet med hoej effekt
DE3012430A1 (de) * 1980-03-31 1981-10-08 Siemens AG, 1000 Berlin und 8000 München Planare halbleiteranordnung mit erhoehter durchbruchsspannung
US4593302B1 (en) * 1980-08-18 1998-02-03 Int Rectifier Corp Process for manufacture of high power mosfet laterally distributed high carrier density beneath the gate oxide
US4412242A (en) 1980-11-17 1983-10-25 International Rectifier Corporation Planar structure for high voltage semiconductor devices with gaps in glassy layer over high field regions

Also Published As

Publication number Publication date
CA1175953A (en) 1984-10-09
DE3145231C2 (en]) 1994-08-11
JPS57112034A (en) 1982-07-12
FR2494499B1 (en]) 1984-06-08
FR2494499A1 (fr) 1982-05-21
CH656255A5 (de) 1986-06-13
US4412242A (en) 1983-10-25
GB2087648A (en) 1982-05-26
JP2766239B2 (ja) 1998-06-18
IT1196932B (it) 1988-11-25
SE8106799L (sv) 1982-05-18
DE3145231C3 (de) 1994-08-11
JPH08250702A (ja) 1996-09-27
JPH09199707A (ja) 1997-07-31
GB2087648B (en) 1985-02-13
JP2766240B2 (ja) 1998-06-18
DE3145231A1 (de) 1982-06-09
SE462309B (sv) 1990-05-28
IT8125123A0 (it) 1981-11-16

Similar Documents

Publication Publication Date Title
JPH0434311B2 (en])
US4399449A (en) Composite metal and polysilicon field plate structure for high voltage semiconductor devices
US5723890A (en) MOS type semiconductor device
JP4839519B2 (ja) 半導体装置
JP2585331B2 (ja) 高耐圧プレーナ素子
JP2870402B2 (ja) 絶縁ゲート型電界効果トランジスタ
JP2968222B2 (ja) 半導体装置及びシリコンウエハの調製方法
US6407413B1 (en) Semiconductor device with guard ring and Zener diode layer thereover
JPH03270273A (ja) 半導体装置およびその製造方法
JP7505217B2 (ja) 超接合半導体装置および超接合半導体装置の製造方法
JPH0427712B2 (en])
JP2008177335A (ja) 炭化珪素絶縁ゲート型半導体装置。
JPS61102068A (ja) 縦型2重拡散mos装置
US11695036B2 (en) Semiconductor device
JP2003174169A (ja) 半導体装置
US20240170569A1 (en) Semiconductor device and method of manufacturing the same
KR101875638B1 (ko) 반도체 소자 및 그 제조 방법
JP4432332B2 (ja) 半導体素子及びその製造方法
EP1081768A2 (en) Insulated gate field-effect transistor and method of making the same
JP6771433B2 (ja) 半導体装置
JP4576805B2 (ja) 絶縁ゲート型半導体素子及びその製造方法
JP4264316B2 (ja) 半導体装置とその製造方法
JP5023423B2 (ja) 縦型絶縁ゲート型電界効果トランジスタおよびその製造方法
JP3744196B2 (ja) 炭化珪素半導体装置及びその製造方法
JP3381490B2 (ja) Mos型半導体装置